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Application Notes

APPLICATION NOTES:

PLASMA:

  • Plasma is the "Fourth State of Matter" and can be defined as a partially or wholly ionized gas with a nearly equal number of positive and negative charged particles. To reach this ionized "state of matter", electrical energy is applied at near vacuum levels, breaking molecular bonds and forming highly reactive atomic species. Various gases react differently in a "plasma state".
  • Oxygen -  When molecularly broken becomes monatomic oxygen and ions. Oxygen in this reactive monatomic state can "chemically link" with hydrocarbons or carbons and become water vapor, carbon monoxied or carbon dioxide. This linking process converts a solid into the gas phase and is evacuated by the vacuum pump.
  • Argon - Is a chemically inert gas even when ionized. Kinetic energy drives the argon atom to collide with other atoms inside the vacuum chamber. As the argon atom physically strikes organic contaminant atoms, contaminants adhereing to the substrate are dislodged and removed by the pumping process.
  • If your products need greater Wettability, Stickability or Bondability dry cleaning with plasma will add quality and productivity. Plasma gets particles that solvents can't reach. Eliminates residue and repeated rinsing. Saves process time (processing takes 3-5 minutes). Optimizes resources wtih unattended processing. Cuts the cost of buying, storing and disposing of solvents. Increases available floor space with smaller cleaning units.

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Plasma Applications:

  • Precision Plastic Products, Hybrid Circuits, Semiconductors, Photomask Production, IC Failure Analysis, Traditional Ashing, Asbestos Ashing, PC De-Smearing, Flatscreen Displays, Medical Probes and Measuring Devices, Biological Sampling, Renewable Energy and Sports Equipment Labeling.

 

SPUTTER DEPOSITION:

  • Physical Vapor Deposition (PVD) - PVD which is "Sputtering" is a low temperature method of depositing both thin metal films and insulator films onto a substrate. The vacuum chamber is evacuated and backfilled with process gas (Argon). The gas is ionized with a positive charge, creating a plasma. The resulting ions are strongly attracted to the purity metal or insulator target material. As the relatively large ions impact the putiy target, atoms/molecules of the purity material are physically removed. A majority of removed purity atoms land on the substrate with sufficient force to adhere .
  • Anatech USA sputter systems are available in a wide range of sizes and configurations. Bench-Top R&D models for SEM and TEM sample preparation using noble metals for conductive coatings. Laboratory models with larger capacity chambers and larger planar magnetron sources. Manual or automated systems.
  • Pilot Production and Large Scale Laboratory - Box Coaters using multiple round or rectangular sources. Fully automated "Touch-Panel" PLC with multiple recipe and program storage. All Touch-Panels with password protection. 

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Sputter Applications:

  • Renewable Energy, Medical Devices, Semiconductor, Materials Research, Scanning Electron and Transmission Electron Microscopy, Biological Research and Microelectronics.