Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules, Flip Chips
Deflash Prior to Wire Bonding for Hybrid Circuits, Multichip Modules and Flip Chips
Download SCE-AL 3030 PDF:
Epoxy flash, deposits to devices during the encapsulation process. This flash migrates to bonding pads and interferes with electrical continuity between bonding wire and pad during the attachment process.
Plasma is commonly used to de-flash epoxy from bonding pads, thereby ensuring a good adhesion and electrical continuity.
Download SCE-108-AL (Tabletop)