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Hummer 8.3 DC/RF Sputter System

Hummer 8.3 DC/RF Sputter System


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Hummer® 8.3 DC/ RF Sputter Systems For Insulator and/or Metal Thin Film Coatings.
System shown in photo has: (Optional) Dual "Flex-Mounted" Source Configuration and Coolant Chiller.

 

 

  • Single cabinet design with most assemblies in the cabinetry except water chiller and roughing pump.
  • Dual stage, direct drive, rotary vane 3.8 CFM vacuum pump.
  • 81 I/ps turbomolecular pump.
  • Vacuum gauge to 1X10-5 Torr.
  • Manually controlled operation in sputter mode.
  • DC Power Supply; 1500 Watt DC
  • RF Power Supply; 300 Watt RF, 13.56 MHz with matching network
  • Siemens S7-200 series PLC based control. "Touch-Panel" control for setting system parameters and diagnostics.
  • Pass word  protected process and recipes
  • Digital display of vacuum
  • Digital display of power
  • Optional: End point by quartz thickness monitor, 1 to 999 nm.
  • Standard 2" diameter RF/DC planar magnetron sputter source, requires 1 gpm at 30° C.
  • Sputter down configuration
  • Safety interlock Hardware for vacuum and high voltage.
  • Stage diameter accommodates up to 200 mm diameter substrates.
  • Stage rotation, 2-RPM on-off selector switch.
  • Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation.
  • Chamber 300 mm diameter x 400 mm height stainless steel construction
  • System is 535 mm x 648 mm footprint x 1219 mm height.
  • OPTIONAL:
  • Multiple Sources - Flex-Mounted 1.3" sources for variable angle of incidence
  • Oxygen Preparation to Class "B" Specifications for reactive sputtering
  • Heated stage to 400° C or 950° C.
  • Cooled stage
  • RF biased stage.
  • Mass Flow Control - 3 gas maximum
  • Coolant Chiller / Recirculator - required
  • Digital Thickness Monitor