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Hummer 8.1 DC Sputter System

Hummer 8.3 DC/RF Sputter System


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Hummer® 8.1 DC Sputter Systems For Metal Thin Film Coatings

  • Single cabinet design with most assemblies in the cabinetry except water chiller and mechanical pump.
  • Dual stage, direct drive, rotary vane 3.8 CFM vacuum pump.
  • 81 I/ps turbomolecular pump.
  • Vacuum gauge to 1X10-5 Torr.
  • Siemens S7-200 series, PLC based control. "Touch-Panel" control pad for setting system parameters and diagnostics.
  • Password protection for process and recipes.
  • Digital display of vacuum
  • Digital display of power
  • DC Power supply - 1500 Watt .
  • 2" diameter planar magnetron sputter source, requires 1 gpm at 30° C.
  • Sputter down configuration.
  • Safety Interlock Hardware for vacuum and high voltage.
  • Stage diameter accommodates up to 200 mm diameter substrates.
  • Stage rotation 2-RPM, on-off selector switch.
  • Plus/minus 20% non-uniformity over 200 mm diameter substrates with rotation.
  • Chamber 300 mm diameter x 400 mm height stainless steel cylindrical chamber.
  • System footprint 535 mm x 648 mm  x 1219 mm (w,d,h).
  • OPTIONAL:
  • Heated stage to 400° C or 950° C.
  • Cooled stage.
  • RF biased stage.
  • Coolant Chiller / Recirculator - required
  • Mass Flow Control - 3 gas maximum
  • Digital Thickness Monitor, 1 to 999nm