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Molecular Level Cleaning Prior to Bonding, Potting, Printing, Marking, Painting


Plasma Cleaning: Essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, inks, potting compound and bonding of other materials.

Bonding: Plasma cleans at the molecular level to promote bonding by removing contamination that might otherwise be trapped. Plasma process, with the right gas mixture, renders the substrate hydrophilic (wetting) by increasing surface energy and decreasing surface tension, such that adhesives spread over the surface of the substrate without voids.

Examples: Microelectronics, Medical Devices, Sports Gear, Photo-mask De-skum, Aerospace, Aircraft and Renewable Energy.

Download SCE-AL-1414 PDF: