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Wet Etch Residue Clean


Plasma process is essential for substrate precleaning at the molecular level. No matter how many rinse steps are used after wet cleaning, some residue remains that can interfere with adherence between the substrate and adhesives, paints, inks, potting compound and bonding of other materials.

Plasma cleans at the molecular level to promote bonding by removing contamination that might otherwise be trapped. Plasma process, with the right gas mixture, renders the substrate hydrophilic (wetting) by increasing surface energy and decreasing surface tension, such that adhesives spread over the surface of the substrate without voids.

Examples include wear harnesses for aircraft (remember this the next time you fly!) and automobiles (or drive!), underwater cables for naval use or for offshore drilling platforms.